Hyperlume Secures $12.5M Seed Funding to Advance Optical Interconnect Solutions for AI Data Centers

Hyperlume is tackling the connectivity bottlenecks in AI data centers by introducing high-speed optical interconnects.

Company Name: Hyperlume
Location: Ottawa, Canada
Industry: Data

Funding Details:

  • Amount: $12.5M (Seed Round)
  • Investors:
    • Lead: BDC’s Deep Tech Venture Fund, ArcTern Ventures
    • Participants: MUUS Climate Partners, SOSV, Intel Capital, LG Technology Ventures

Purpose of Investment:

  • Accelerate development of optical interconnect technologies
  • Expand product, engineering, and R&D teams
  • Strengthen strategic partnerships with hyperscalers, chip manufacturers, and AI infrastructure providers
  • Prepare for production of 800G and 1.6T optical interconnect solutions

Leadership:

Product:

Hyperlume is developing low-energy optical interconnect solutions that improve chip-to-chip communication in AI and accelerated computing environments. Using ultra-fast microLEDs and ultra-low-power circuitry, the company aims to replace traditional copper interconnects, reducing energy consumption while enhancing performance and scalability.

About the Company:

Founded in 2022, Hyperlume is tackling the connectivity bottlenecks in AI data centers by introducing high-speed optical interconnects. By leveraging cutting-edge optical technology, the company offers solutions that increase bandwidth, lower latency, and enhance energy efficiency, making AI and high-performance computing infrastructure more sustainable.

Future Plans:

With this funding, Hyperlume will scale its optical technology production to meet the growing demand for 800G and 1.6T interconnects, supporting next-generation AI and cloud computing infrastructure.

Read next