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Feed The AI Team

Tracking trends and insights in the world of Ai and robotics.

Track3D Raises $3.4M in Seed Funding to Expand Reality Intelligence Platform for Construction Industry

Track3D’s platform is already being utilized by enterprise clients such as Hensel Phelps and Performance Contracting, Inc. (PCI), helping them leverage AI-driven insights to optimize their construction processes.

Glean Raises Over $260M in Series E Funding to Scale AI Innovation and Global Expansion

Glean’s AI-powered platform serves a wide range of industries, with customers including Reddit, Instacart, Pinterest, Duolingo, Databricks, BILL, Samsara, Grammarly, and major enterprises in telecommunications, banking, retail, semiconductors, electronics, and manufacturing.

Key Ward Raises €1M in Funding to Scale AI-Powered Engineering Data Management Platform

Key Ward’s platform is used across various industries, including automotive, aerospace, wind energy, and packaging, providing engineers with a powerful tool to enhance efficiency, improve design accuracy, and accelerate innovation through AI-powered data management.

Smartcat Raises $43M in Series C Funding to Meet Growing Demand for AI-Based Translation Solutions

Smartcat is an AI-powered solution that allows businesses to efficiently translate and generate content at scale, enhancing their global reach and operational efficiency.

Forterra Raises $75M in Series B Funding to Scale Autonomous Driving System Deployment

Forterra specializes in self-driving technology aimed at military and industrial applications.

SiLC Technologies Receives Investment from Honda to Advance AI-Based Machine Vision

SiLC Technologies leverages advanced silicon photonics to create AI-powered machine vision systems.

AttoTude Raises $29M in Series A Funding to Advance AI and Hyperscale Data Center Interconnect Technology

AttoTude is advancing the field of data networking with a focus on creating scalable, high-performance solutions for hyperscale data centers and AI-driven applications, pushing the boundaries of existing interconnect technologies.